Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545402 | Semiconductor wafer, semiconductor chip, and dicing method | Yasushi Kameda | 2023-01-03 |
HH
Hiromitsu HARASHIMA
Overall (2023): #425,499 of 537,848Top 80%
1
Patents 2023