Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744018 | Component assemblies and embedding for high density electronics | John Bultitude, Peter Blais, James A. Burk, Galen W. Miller, Allen Templeton +2 more | 2023-08-29 |
| 11621126 | Resonant multilayer ceramic capacitors | John Bultitude, Nathan A. Reed, Allen Templeton, James R. Magee, James Davis +2 more | 2023-04-04 |