YL

Yung-Cheng Lee

UC University of Colorado: 1 patents #6 of 91Top 7%
📍 Boulder, CO: #248 of 694 inventorsTop 40%
🗺 Colorado: #1,720 of 5,391 inventorsTop 35%
Overall (2023): #188,944 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11598594 Micropillar-enabled thermal ground plane Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more 2023-03-07