Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837509 | Method of manufacturing and packaging silicon photonics integrated circuit dies in wafer form | Keith Nellis, Loi N. Nguyen | 2023-12-05 |
HC
Hsu-Feng Chou
Overall (2023): #420,735 of 537,848Top 80%
1
Patents 2023