Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11591118 | Layered food packaging system, temporary placement apparatus, and carrier device | Haruhiko Koike, Tomoya Hyodo, Koji Hara, Tomohiro Kamishio, Atsuo Ikeda | 2023-02-28 |