Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688557 | Capacitor and etching method | Kazuhito Higuchi, Susumu Obata, Mitsuo Sano | 2023-06-27 |
| 11610860 | Wire bonding apparatus and wire bonding method | Masatoshi Tanabe, Takashi Ito, Akira Tojo | 2023-03-21 |
| 11588059 | Structural body and method of manufacturing the same | Mitsuo Sano, Susumu Obata, Kazuhito Higuchi | 2023-02-21 |
| 11551864 | Capacitor and capacitor module | Keiichiro Matsuo, Susumu Obata, Mitsuo Sano, Kazuhito Higuchi | 2023-01-10 |