Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856836 | Semiconductor device comprising adhesive layer and resin layer | Seiji Yasumoto, Kayo Kumakura, Satoru Idojiri, Hiroki Adachi, Kenichi OKAZAKI | 2023-12-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856836 | Semiconductor device comprising adhesive layer and resin layer | Seiji Yasumoto, Kayo Kumakura, Satoru Idojiri, Hiroki Adachi, Kenichi OKAZAKI | 2023-12-26 |