Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823920 | Apparatus for attaching semiconductor parts | Jung Min Park | 2023-11-21 |
| 11798864 | Semiconductor package with metal post having non-vertical structure | — | 2023-10-24 |
| 11721615 | Coupled semiconductor package | — | 2023-08-08 |
| 11682610 | Semiconductor package with heat radiation board | Younghun Kim, Jeonghun Cho | 2023-06-20 |
| 11676931 | Semiconductor package | Jeonghun Cho, Young Hun Kim, Taeheon Lee | 2023-06-13 |
| 11631627 | Method of manufacturing semiconductor having double-sided substrate | — | 2023-04-18 |