Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11635361 | Traceable in-situ micro- and nano-indentation testing instrument and method under variable temperature conditions | Hongwei Zhao, Zhaoxin Wang, Jianhai Zhang, Peng Liu, Cong Li +6 more | 2023-04-25 |
| 11626335 | IC packaging structure and IC packaging method | Lei Zhong | 2023-04-11 |