Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823911 | Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillars | Haishen Kong, Yubin Lin, Xinfu Liang, Qingyun Zhou | 2023-11-21 |