Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616187 | Superconducting bump bond electrical characterization | Aurelius L. Graninger, Joel D. Strand, Micah John Atman Stoutimore, Jeffrey David Hartman, JUSTIN C. HACKLEY | 2023-03-28 |