Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11773262 | Resin, copper clad laminate made of resin, and printed circuit board | Shih-Hao Liao, Min-Yuan Yang, Jheng-Hong CIOU, Cheng-Chung Chen | 2023-10-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11773262 | Resin, copper clad laminate made of resin, and printed circuit board | Shih-Hao Liao, Min-Yuan Yang, Jheng-Hong CIOU, Cheng-Chung Chen | 2023-10-03 |