Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11714649 | RISC-V-based 3D interconnected multi-core processor architecture and working method thereof | Gang Wang, Jinzheng Mou, Yang-Soo An, Moujun Xie, Benyang Wu +4 more | 2023-08-01 |