Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735692 | Using a compliant layer to eliminate bump bonding | — | 2023-08-22 |
| 11688638 | Production of very small or thin dies | Joey John Michalchuk | 2023-06-27 |
| 11569077 | Compact electrostatic ion pump | Sterling Eduardo McBride, Joey John Michalchuk, Christopher Holland, Ashish Chaudhary | 2023-01-31 |