Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830785 | Package with windowed heat spreader | Youngmin Kim, Yongmin Kim | 2023-11-28 |
| 11735489 | Semiconductor device and method of forming hybrid TIM layers | Youngcheol Kim, Youngmin Kim, Yongmin Kim | 2023-08-22 |