Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670620 | Device with embedded high-bandwidth, high-capacity memory using wafer bonding | Khandker N. Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner +3 more | 2023-06-06 |