Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616027 | Integrated circuit packages to minimize stress on a semiconductor die | Ramji Sitaraman Lakshmanan, Bernard Patrick Stenson, Padraig L. Fitzgerald, Oliver Kierse, Michael John Flynn +1 more | 2023-03-28 |