Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581195 | Semiconductor package having wettable lead flank and method of making the same | Yan Xun Xue, Long Wang, Adrian Chee Heong Koh, Peter H. Wilson, Feng Ye | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581195 | Semiconductor package having wettable lead flank and method of making the same | Yan Xun Xue, Long Wang, Adrian Chee Heong Koh, Peter H. Wilson, Feng Ye | 2023-02-14 |