Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605721 | Sputtering electrode with multiple metallic-layer structure for semiconductor device and method for producing same | Haodian Shi, Yanqing Wu, Anping Hu, Xibei Yu | 2023-03-14 |