Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605560 | Die division method and inspection apparatus for avoiding defects locations on silicon carbide wafers | Min-Kyu Park | 2023-03-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605560 | Die division method and inspection apparatus for avoiding defects locations on silicon carbide wafers | Min-Kyu Park | 2023-03-14 |