Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828877 | Optical sensor package with encapsulant is between and separates substrates and multiple assemblies | — | 2023-11-28 |
| 11721657 | Wafer level chip scale package having varying thicknesses | — | 2023-08-08 |
| 11581232 | Semiconductor device with a dielectric between portions | — | 2023-02-14 |