Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749538 | Device for degumming and inserting silicon wafers and method for processing silicon wafers | Hong LI, Hong Chen, Jian Jing, Jun Wang, Guangquan Zhang +1 more | 2023-09-05 |
| 11728186 | Device for conveying and dispersing silicon wafers | Hong LI, Hong Chen, Jun Wang, Jian Jing, Guangquan Zhang +3 more | 2023-08-15 |