Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832396 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang +1 more | 2023-11-28 |
| 11721641 | Weight optimized stiffener and sealing structure for direct liquid cooled modules | Madhusudan K. Iyengar, Connor Burgess, Padam Jain, Emad Samadiani | 2023-08-08 |
| 11600548 | Methods and heat distribution devices for thermal management of chip assemblies | Woon-Seong Kwon, Zhi Yang | 2023-03-07 |