Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848292 | Pad design for thermal fatigue resistance and interconnect joint reliability | Sireesha Gogineni, Yi Xu | 2023-12-19 |
| 11694976 | Bowl shaped pad | Sireesha Gogineni, Yi Xu | 2023-07-04 |
| 11569144 | Semiconductor package design for solder joint reliability | Yi Xu | 2023-01-31 |