Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823942 | Thermocompression bonding method for workpiece | Naoko Yamamoto, Atsushi Kubo | 2023-11-21 |
| 11610815 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-03-21 |
| 11594454 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-28 |
| 11587833 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11587832 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11569129 | Workpiece processing method | Jinyan Zhao | 2023-01-31 |
| 11545393 | Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-01-03 |