Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735463 | Processing method for wafer | Yusuke FUJII | 2023-08-22 |
| 11610815 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2023-03-21 |
| 11594454 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-28 |
| 11587832 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11587833 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11545393 | Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer | Shigenori Harada, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2023-01-03 |