Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744022 | Method for manufacturing a circuit having a lamination layer using laser direct structuring process | Seung-hyuk Choi, Hyun Jun Hong, Tae Wook Kim, Cheong Ho Ryu, Sung Jun Kim | 2023-08-29 |