Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664256 | Placement system for door of wafer pod | Dongfeng Zhang, Weicheng Bao, Wenguang Wang, Ying Ye | 2023-05-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664256 | Placement system for door of wafer pod | Dongfeng Zhang, Weicheng Bao, Wenguang Wang, Ying Ye | 2023-05-30 |