Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817360 | Chip scale package semiconductor device and method of manufacture | Loh Choong Keat, Edward Then | 2023-11-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817360 | Chip scale package semiconductor device and method of manufacture | Loh Choong Keat, Edward Then | 2023-11-14 |