Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811182 | Solderless BGA interconnect | Mohammed Rahman, Bilal Khalaf | 2023-11-07 |
| 11646253 | Ball interconnect structures for surface mount components | — | 2023-05-09 |
| 11562978 | Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same | Florence R. Pon, John Yap | 2023-01-24 |