Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658159 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong | 2023-05-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658159 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong | 2023-05-23 |