Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658159 | Methods and apparatus for managing thermal behavior in multichip packages | Tonia G. Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong | 2023-05-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658159 | Methods and apparatus for managing thermal behavior in multichip packages | Tonia G. Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong | 2023-05-23 |