Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798904 | Semiconductor structure, redistribution layer (RDL) structure, and manufacturing method thereof | Wen-Hao Hsu | 2023-10-24 |
| 11711029 | Method of controlling power converter and power converter | Kai-Wei Hu, Lei-Chung Hsing | 2023-07-25 |
| 11611291 | Power system and pulse width modulation method therefor | Kai-Wei Hu, Mitradatta Misra | 2023-03-21 |
| 11605605 | Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof | Wen-Hao Hsu | 2023-03-14 |
| 11587893 | Distribution layer structure and manufacturing method thereof, and bond pad structure | Chieh-Ting Hsu | 2023-02-21 |