Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587893 | Distribution layer structure and manufacturing method thereof, and bond pad structure | Ping-Heng Wu | 2023-02-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587893 | Distribution layer structure and manufacturing method thereof, and bond pad structure | Ping-Heng Wu | 2023-02-21 |