Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842974 | Solder material and method for die attachment | Angelo Gulino, Bogdan BANKIEWICZ, Anna Lifton, Michael T. Marczi, Girard Sidone +2 more | 2023-12-12 |
| 11699632 | Methods for attachment and devices produced using the methods | Monnir Boureghda, Nitin Desai, Anna Lifton, Michael T. Marczi, Bawa Singh | 2023-07-11 |