Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11845697 | Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body | Kyohei ATSUJI, Asumi NAGAI, Yuji Katsuda | 2023-12-19 |
| 11548829 | Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device | Asumi NAGAI, Hirofumi Yamaguchi | 2023-01-10 |