Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742277 | Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrate | Shahram Nikoukary, Jonghyun Cho, Ming Li | 2023-08-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742277 | Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrate | Shahram Nikoukary, Jonghyun Cho, Ming Li | 2023-08-29 |