Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839054 | Stack-PCB design and midplane architecture | Brian Toleno, Patrick Codd | 2023-12-05 |
| 11796258 | Sealing a heat pipe | Tzu-Yuan Lin, Erin Hurbi, Dong Woo Kim | 2023-10-24 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839054 | Stack-PCB design and midplane architecture | Brian Toleno, Patrick Codd | 2023-12-05 |
| 11796258 | Sealing a heat pipe | Tzu-Yuan Lin, Erin Hurbi, Dong Woo Kim | 2023-10-24 |