Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742277 | Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrate | Shahram Nikoukary, Jonghyun Cho, Nitin Juneja | 2023-08-29 |
| 11657868 | Multi-die memory device | Scott C. Best | 2023-05-23 |