Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830817 | Creating interconnects between dies using a cross-over die and through-die vias | Rahul Agarwal, Raja Swaminathan, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more | 2023-11-28 |