Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11732330 | High reliability lead-free solder alloy for electronic applications in extreme environments | Lik Wai Kho | 2023-08-22 |
| 11724342 | Cost-effective lead-free solder alloy for electronic applications | Lik Wai Kho | 2023-08-15 |
| 11577343 | Low-silver alternative to standard SAC alloys for high reliability applications | Lik Wai Kho | 2023-02-14 |