Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791278 | Display substrate motherboard and manufacturing method thereof, display substrate and display apparatus | Lei Yao, Feng Li, Lei Yan, Kai Li, Chenglong Wang +2 more | 2023-10-17 |
| 11710747 | Array substrate, manufacturing method thereof, and display device | Fang Yan, Dawei Shi, Lei Yao, Zifeng Wang, Wentao Wang +6 more | 2023-07-25 |
| 11646282 | Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2023-05-09 |
| 11646283 | Bonded assembly containing low dielectric constant bonding dielectric material | Peter Rabkin, Masaaki Higashitani, Ramy Nashed Bassely Said | 2023-05-09 |
| 11637134 | Array substrate, method for manufacturing the same, and display device | Jinjin Xue, Dawei Shi, Feng Li, Lei Yao, Wentao Wang +5 more | 2023-04-25 |
| 11562975 | Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2023-01-24 |
| 11547943 | Providing social network content in games | Jinming Cao, Chao Guo, Xingguang Yu, Huiqiang Liu, Kerry Yang +1 more | 2023-01-10 |