Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li | 2023-06-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li | 2023-06-20 |