Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11630934 | Integrated circuit analysis using a multi-level data hierarchy implemented on a distributed compute and data infrastructure | Ajay Singh Bisht, Mark W. Brown, Arney Deshpande, Yibing Wang, Ramakrishnan Balasubramanian | 2023-04-18 |