Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11633904 | Long plastic layer with embossing in register with pattern and rolling method and device therefor | Wenjin Tang, Caiqin Zhu | 2023-04-25 |
| 11633905 | Long decorative material with embossing in register with pattern and rolling method and device therefor | Wenjin Tang, Caiqin Zhu | 2023-04-25 |
| 11630934 | Integrated circuit analysis using a multi-level data hierarchy implemented on a distributed compute and data infrastructure | Jayanta Roy, Ajay Singh Bisht, Mark W. Brown, Arney Deshpande, Ramakrishnan Balasubramanian | 2023-04-18 |