Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811957 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Chung Ju YU, Jui-Hsien Wang, Chai-Chi Lin | 2023-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811957 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Chung Ju YU, Jui-Hsien Wang, Chai-Chi Lin | 2023-11-07 |