Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811957 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Chung Ju YU, Chai-Chi Lin, Hong Jie Chen | 2023-11-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811957 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Chung Ju YU, Chai-Chi Lin, Hong Jie Chen | 2023-11-07 |