Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721669 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Junyeong Heo, Jae Eun Lee, Yeongkwon Ko | 2023-08-08 |