Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Yi-Jou Lin, I-Hsuan Peng | 2023-11-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Yi-Jou Lin, I-Hsuan Peng | 2023-11-28 |