Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11604903 | Layered analytical modeling of telecom tower structure and scenario analysis | Apurba Tribedi, Pankaj Taneja, Achintya Tribedi, Aaron Poot, Adam Junstrom +1 more | 2023-03-14 |